TER

Teradyne, Inc.

Date

Aug 2

Memory Shortage Through 2028 Starves AI Inference Hardware — Long HBM Packaging Beneficiaries

Samsung forecasts memory shortage extending to 2028, driven by AI accelerator demand. Market focuses on DRAM producers. The real trade is upstream in advanced packaging: HBM memory requires complex CoWoS/SoIC interposer work, and that substrate/packaging capacity is the true bottleneck. Long US-listed advanced packaging and substrate suppliers.

Good for ↑TERCOHR

AMAT

TheGamerAug 2

Technology